Quality Engineering Consulting
Implement advanced quality engineering consulting solutions to enhance product reliability, ensuring superior compliance and customer satisfaction.
Global Engineering Consulting
Collaborate with professional engineering consultants in USA to maintain high-quality standards across diverse global manufacturing environments.
Advanced Engineering Testing
Apply cutting-edge engineering consulting techniques for early issue detection, ensuring compliance, innovation, and product excellence.
- Our Services -
Test Services Offered
Burn-In test
- Burn-in testing places devices in high stress environment. The stress conditions that are applied to devices during burn-in are an effective method of aging the devices. In particular, burn-in testing is used to check for internal metal migration or metal expansion that can effect device operation.
- Devices are placed in burn-in boards which are built from high temperature tolerant material that can withstand constant temperature exposures of up to 150°C. The boards are then placed into the burn-in chambers. A voltage bias higher than the nominal voltage level is applied to the devices in order to add additional stress during this test. The test is performed at 125°C for 168 hours.
- ReliaTest Labs designs and manufactures burn-in systems including high performance thermal chambers, Burn-In boards, driver boards, and system software. It includes full-service Burn-In Test capabilities to enable qualification of devices/products at different temperatures with simultaneous electrical stimulus.
- JEDEC Standard JESD22-A108 as well as other industry and customer specific standards are implemented.
HAST/PCT
- HAST testing accelerates the penetration of moisture through the external protective materials or sealants or between the external material and conductors. This is done by applying pressure under set conditions of Temperature and Humidity continuously. This uses a non-condensing (unsaturated method) of applying super-heated steam in a pressurized and temperature controlled environment.
- Biased and Unbiased HAST Testing
- HAST testing has become a standard, particularly in the Semiconductor, Solar and other Industries as the fast and effective alternative to the standard Temperature Humidity Bias testing (85C/85%RH-1000 hrs).
- The HAST (Highly-Accelerated Temperature and Humidity Stress Test) has become a critical part of the device package Reliability & Qualification process. It is predominantly used to evaluate the reliability of non-hermetic packaged devices under humidity environments. This is done by setting and creating the various conditions of Temperature-Humidity-Pressure within a highly controlled pressure vessel. These conditions accelerate moisture penetration through the external protective plastic package and apply these stress conditions to the die/device.
HTOL/LTOL
- High Temperature Operating Life testing is conducted at 125°C with an applied voltage bias higher than the nominal voltage level. The test duration is for 1000 hours. Test parameters, such as time and/or temperature, can be altered in order to accelerate the test. Intermediate measurements, using the standard production test program, are made to the devices at 24, 168, and 500 hours into the test.
- Failures are monitored and analyzed for long-term stress effects that the products are expected to undergo. Metal electromigration, oxidation, and other common high temperature and voltage stress related failures are noted as test failures.
- The LTOL Test is becoming a more frequent test now. Since the industry is moving towards low profile/low geometry device packages, additional efforts are required to gather more failure data at low temperatures. The decreasing of low geometries require the frequencies to go higher thereby increasing the Hot Carrier Injection (HCI). This is one of the causes of degradation which leads to deterioration of devices leading to failures.
Humidity
- Pre-Conditioning Service
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Plastic SMD’s and/or non-hermetic solid state devices are subjected to preconditioning tests prior to moving into other reliability testing sequences. Some of the test combinations for these Moisture Tests are:
85C/85%RH, 85C/60%RH, 30C/60%RH
Other options for accelerated soak conditions require 60C/60%RH
Reference: JEDEC Standard JESD22-A113 - To define and evaluate the moisture resistance on non- hermetic packages and solid state devices in humid environments under high temperature and humidity conditions. This is an accelerated test that causes the penetration of moisture to the device under test.
Salt Fog/Spray Corrosion
- Salt spray testing is an accelerated test that determines the test device’ resistance to corrosion
- Compare corrosive resistance
- Determine corrosive tendency when surface is scratched (ASTM B117 + ASTM D1654)
- Measure coating adhesion, corrosion creep (ASTM B117+ ASTM D3359)
Sand and Dust
- Settling Dust tests are designed to measure the effectiveness of an enclosure at preventing dust ingress. Dust can act as an abrasive when it gets between moving parts.
- Settling dust chambers test products by essentially showering a product with coats of dust within the chamber; this simulates the natural accumulation of dust from a product sitting in a typical location open to the atmosphere.
- Dust protection of products are defined with an IP code rating established by IEC standard 60259. A product rated IP5X is dust protected, which means that dust ingress not fully prevented but is within tolerances of adequate product functionality; an IP6X rated product is fully protected from dust ingress.
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Engineering Services
Concept Phase
Our gap analysis methodology allows our customers to determine their organization reliability maturity level and enable them to develop a startegy to reach the next level.
Design Phase
Customers and markets are requiring product development teams to predict the product reliability in terms of MTBF. The resulting MTBF has various applications.
Validation Phase
The objective of this activity is to design a set of reliability tests that should be performed on the product. Examples of these tests are HALT, FIT, RDT and ORT.
Manufacturing Phase
Any product and even well designed ones could experience high rate of early life failures. This could be attributed by the variability in the manufacturing process.
Reliability for Software Design
Traditionally there has been lots of focus on hardware reliability and availability. In fact, software has similar or increased chances of failure as well.
Work with Professional Engineering Consultants USA
Enhance your product’s reliability and quality with tailored solutions. Contact us today for expert engineering consulting services USA.